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CORC

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Effects of Brazing Temperature on Microstructure and High-Temperature Strength of Joints Using a Novel Fourth-Generation Nickel-Based Single Crystal Superalloy 期刊论文
METALS AND MATERIALS INTERNATIONAL, 2022, 页码: 13
作者:  Zhang, Z. P.;  Liu, J. D.;  Qiu, K. Q.;  Huang, Y. Y.;  Li, J. G.
收藏  |  浏览/下载：33/0  |  提交时间：2022/07/14
A hot-compression bonding method for manufacturing large high-speed homogeneous steels 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 卷号: 17, 页码: 507-520
作者:  Liu, Weifeng;  Zhang, Jianyang;  Sun, Mingyue;  Xu, Bin;  Cao, Yanfei
收藏  |  浏览/下载：17/0  |  提交时间：2022/07/01
Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 4, 页码: 4484-4496
作者:  Cheng, Qiang;  Zheng, LiLi;  Li, XiChao;  Xu, Bin;  Sun, MingYue
收藏  |  浏览/下载：22/0  |  提交时间：2022/07/01
Electrochemical Corrosion Behavior of CoCrNi Medium Entropy Alloy and SUS-304 Stainless Steel Diffusion Welded Joints at Various Bonding Temperatures 期刊论文
PHYSICS OF METALS AND METALLOGRAPHY, 2021, 卷号: 122, 期号: 14, 页码: 1561-1571
作者:  Samiuddin, Muhammad;  Jinglong, Li;  Siddiqui, Muhammad Ali;  Jiangtao, Xiong;  Ling, Ren
收藏  |  浏览/下载：9/0  |  提交时间：2022/07/01
Effect of surface cleaning on interface bonding performance for 316H stainless steel joints manufactured by additive forging 期刊论文
MATERIALS & DESIGN, 2021, 卷号: 210, 页码: 16
作者:  Zhao, Yong;  Jin, Zhuji;  Xu, Bin;  Wang, Qinqiang;  Feng, Jian
收藏  |  浏览/下载：30/0  |  提交时间：2021/11/22
Effect of post-bond heat treatment on the microstructure and high temperature mechanical property of a TLP bonded gamma '-strengthened co-based single crystal superalloy 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 80, 页码: 244-258
作者:  Wang, S. Y.;  Sun, Y.;  Cui, C. Y.;  Sun, X. F.;  Zhou, Y. Z.
收藏  |  浏览/下载：46/0  |  提交时间：2021/10/15
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
Development of Diffusion Bonded Joints of AA6061 Aluminum Alloy to AISI 316LN Stainless Steel for Sirius Planar Undulators 会议论文
Brazil, 2021
作者:  R.L. Parise;  O.R. Bagnato;  R. Defavari;  M.W.A. Feitosa;  F.R. Francisco
收藏  |  浏览/下载：44/0  |  提交时间：2022/01/18
Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 46, 页码: 1-11
作者:  Zhang, Jian Yang;  Xu, Bin;  Tariq, Naeemul Haq;  Sun, MingYue;  Li, DianZhong
收藏  |  浏览/下载：126/0  |  提交时间：2021/02/02

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