×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
金属研究所 [42]
厦门大学 [5]
清华大学 [4]
兰州理工大学 [4]
重庆绿色智能技术研究... [3]
北京大学 [2]
更多...
内容类型
期刊论文 [74]
学位论文 [1]
发表日期
2022 [3]
2021 [3]
2020 [7]
2019 [7]
2018 [3]
2014 [2]
更多...
学科主题
Materials ... [3]
Metallurgy... [2]
Physics [2]
Chemistry,... [1]
Engineerin... [1]
Materials ... [1]
更多...
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共75条,第1-10条
帮助
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Metal/antiperovskite metal nitride composites Ag/AgNNi (3) as novel efficient electrocatalysts for hydrogen evolution reaction in alkaline media
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2022, 卷号: 112
作者:
Zhu, Lili
;
Yang, Bingbing
;
Wu, Ziqiang
;
Li, Changdian
;
Li, Han
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/12/23
Hydrogen evolution reaction
Antiperovskite
Metal nitride
Composite catalyst
Plastic deformation induced formation of supersaturated solid solution nanostructure in a dual-phase Cu-Ag alloy
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 903, 页码: 6
作者:
Han, Z. X.
;
Han, Z.
;
Luo, Z. P.
;
Wang, Z. B.
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/07/01
Dual-phase Cu alloy
Surface mechanical grinding treatment
Gradient nanostructured
Chemical mixing
Supersaturated solid solution
Effect of La addition on Ag-rich phase formation and mechanical properties of Cu-2Ag alloys
期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 卷号: 18, 页码: 998-1008
作者:
Hu, Peng-Hong
;
Zhang, Shi-Hong
;
Chen, Shuai-Feng
;
Chen, Yan
;
Song, Hong-Wu
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/07/14
Copper alloy
Rare earth
Ag-rich phase
Strength
Electrical conductivity
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:
Chen, Yinbo
;
Wang, Changchang
;
Gao, Yue
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/01/27
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2022/02/17
Binary alloys
Copper alloys
Electromigration
Tensile strength
Tin alloys
Bonding joints
Co content
Coaddition
Current direction
Electric density
Micro-structure evolutions
Solder joints
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
作者:
Yang, Jie
;
Zhang, Qingke
;
Song, Zhenlun
收藏
  |  
浏览/下载:133/0
  |  
提交时间:2021/02/02
SnBi solder
Ag and In addition
microhardness
nano-indentation
impact toughness
fracture mechanism
Thermodynamics and solidification kinetics of Ag-Ni-Co immiscible alloys
期刊论文
JOURNAL OF MATERIALS SCIENCE, 2020, 页码: 17
作者:
Deng, Congkun
;
Jiang, Hongxiang
;
Zhao, Jiuzhou
;
Zhang, Lili
;
He, Jie
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
Structure-Dependent Thermoelectric Properties of GeSe1-xTex(0 <= x <= 0.5)
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2020, 卷号: 12, 期号: 37, 页码: 41381-41389
作者:
Wang, Zhiran
;
Wu, Hong
;
Xi, Ming
;
Zhu, Huaxing
;
Dai, Lu
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/12/01
thermoelectric
structure
GeSe1-xTex
defects
carrier concentrations
Separating and recycling metal mixture of pyrolyzed waste printed circuit boards by a combined method
期刊论文
WASTE MANAGEMENT, 2020, 卷号: 107, 页码: 113-120
作者:
Chen, Bin
;
He, Jie
;
Sun, Xiaojun
;
Zhao, Jiuzhou
;
Jiang, Hongxiang
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2021/02/02
Metal recycling
Liquid-liquid phase separation
Waste printed circuit boards
Low-temperature alkaline smelting
Noble metals
©版权所有 ©2017 CSpace - Powered by
CSpace