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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 发表日期：2016    专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y. 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Chip scale packages  Electronics packaging  Finite element method  Reliability  Thermal cycling  Viscoelasticity  Chip deformations  Relaxation modulus  Silicon interposers  Temperature dependent  Thermal-mechanical reliability  Time dependent  Viscoelastic properties  Williams-Landel-Ferry equations  Three dimensional integrated circuits   Numerical Simulation and Optimization Analysis of Anti-/De-Icing Component of Helicopter Rotor Based on Big Data Analytics 会议论文 Joint Conference of the 16th Asia Simulation Conference / SCS International Autumn Simulation Multi-Conference (AsiaSim/SCS AutumnSim), Beijing, PEOPLES R CHINA, 2016-01-01 作者:  Chen, Long;  Zhang, Yidu;  Wu, Qiong;  Chen, Zhengsheng;  Peng, Youyun 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Big data analytics  Composite material anti-/de-icing component  Temperature field  Finite element numerical simulation  Optimization method   The interior working mechanism and temperature characteristics of a fluid based micro-vibration isolator 期刊论文 JOURNAL OF SOUND AND VIBRATION, 2016, 卷号: 360, 页码: 1-16 作者:  Wang, Jie;  Zhao, Shougen;  Wu, Dafang;  Jing, Xingjian 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30 Damping  Design and application  Engineering practices  Environmental temperature  Lumped parameter modeling  Performance objective  Stiffness characteristics  Temperature characteristic  Temperature environments  Finite element method