QQ客服 官方微博 反馈留言

浏览/检索结果: 共11条，第1-10条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A Novel Surveillance System Applied in Civil Airport 其他 2016-01-01 Sun, Hua Bo; Zhong, Min Zhu; Miao, Ling Yun; Wang, Xin; Zhao, Hai Meng 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Childhood sexual abuse and the development of recurrent major depression in Chinese women 其他 2015-01-01 作者:  Chen, Jing;  Cai, Yiyun;  Cong, Enzhao;  Liu, Ying;  Gao, Jingfang 收藏  |  浏览/下载：17/0  |  提交时间：2019/12/02 Electrical measurement and analysis of TSV/RDL for 3D integration 其他 2014-01-01 Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS   Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他 2013-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16 A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他 2012-01-01 Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Parametric Study, Modeling of Etching Process and Application for Tapered Through-Silicon-Via 其他 2012-01-01 Ma, Shenglin; Zhong, Xiao; Bian, Yuan; Sun, Xin; Zhu, Yunhui; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Development of a Through-Stack-Via Integrated SRAM Module 其他 2012-01-01 Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 Process Development of a Stacked Chip Module with TSV Interconnection 其他 2012-01-01 Zhong, Xiao; Ma, Shenglin; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Cui, Qinghu; Miao, Min; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 SILICON  INTEGRATION