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JCDL 2018 Workshop Proposal - Image Collections: Creation, Organization, Access, and Use 其他
2018-01-01
作者:  Lu, Wei;  West, Jevin;  O'connor, Brian;  Matusiak, Krystyna;  Zhu, Qinghua
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
Method of Smartphone Navigation Heading Compensation Based on Gravimeter 其他
2018-01-01
作者:  Zeng, Shijie;  Zeng, Qinghua;  Meng, Qian;  Liu, Jianye;  Chen, Ruizhi
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Method of Smartphone Navigation Heading Compensation Based on Gravimeter 其他
2018-01-01
作者:  Zeng, Shijie;  Zeng, Qinghua;  Meng, Qian;  Liu, Jianye;  Chen, Ruizhi
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
JCDL 2018 Workshop Proposal - Image Collections: Creation, Organization, Access, and Use 其他
2018-01-01
作者:  Lu, Wei;  West, Jevin;  O'connor, Brian;  Matusiak, Krystyna;  Zhu, Qinghua
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

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