QQ客服 官方微博 反馈留言

浏览/检索结果: 共14条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Chen, Jing[2];  Jin, Yufeng[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 TSV  3D packaging  sidewall insulation  electrical properties  CMP   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录) 会议 作者:  Liu, Huan[1];  Zeng, Qinghua[1];  Guan, Yong[1];  Fang, Runiu[1];  Sun, Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Jin, Yufeng[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Hen, Jing C.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System   An Improved Harmonic Current Detection Method Based on Parallel Active Power Filter (EI收录) 会议 Shanghai, China, 作者:  Zeng, Zhiwu[1];  Xie, Yunxiang[1];  Wang, Yingpin[1];  Guan, Yuanpeng[1];  Li, Lanfang[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Bandpass filters  Electric current measurement  Harmonic analysis  Low pass filters   An Improved Harmonic Current Detection Method Based on Parallel Active Power Filter (CPCI-S收录) 会议 作者:  Zeng, Zhiwu[1];  Xie, Yunxiang[1];  Wang, Yingpin[1];  Guan, Yuanpeng[1];  Li, Lanfang[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Ma, Shenglin[2];  Zeng, Qinghua[1];  Meng, Wei[1,3];  Chen, Jing[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Zeng, Qinghua[2];  Guan, Yong[2];  Chen, Jing[2];  Jin, Yufeng[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 MEMS packaging  reliability  RDL opening  copper thickness  insulation layer thickness   Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Meng, Wei[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 through silicon via  packaging  electroplating  additives