CORC

在结果中检索

CORC

浏览/检索结果: 共13条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Effect of different coatings on the weldability of Al to steel 会议论文
Tokyo, Japan, July 30, 2018 - August 3, 2018
作者:  Sun, Junhao;  Li, Zhuguo;  Huang, Jian;  Cao, Rui
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15
Thermal Simulation Analysis of Temperature Distribution Characteristics in 220kV GIS 会议论文
作者:  Sun, Shanyuan;  Zhang, Liang;  Li, Junhao;  Wu, Xutao;  Ma, Bo
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/19
Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Kunwar, Anil;  Ma, Haoran;  Qi, Meng;  Sun, Junhao;  Qu, Lin
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
In situ aging study on the variation of Sn0. 7Cu/Cu solid interface marked by bubbles 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA
作者:  Ma, Haoran;  Kunwar, Anil;  Sun, Junhao;  Zhao, Ning;  Huang, Mingliang
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Liu, Jiahui;  Ma, Haitao;  Li, Shuang;  Sun, Junhao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
The characterization of CuInSe2 thin films by sequential processes of sputtering and selenization 会议论文
8th International Conference on Thin Film Physics and Applications (TFPA), 2013-09-20
作者:  Zhang, Jun[1];  Deng, Hongmei[2];  Yang, Pingxiong[3];  He, Jun[4];  Liu, Tantan[5]
收藏  |  浏览/下载：12/0  |  提交时间：2019/04/30

©版权所有 ©2017 CSpace - Powered by CSpace