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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of rapid inducted heating on the microstructure of solder joint in IC 会议论文 19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycling  microstructure  IMC  electronic packaging   Research on microstructures of double interfaces SAC305 solder joint by RPC 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycling  microstructure  IMC  electronic packaging   Performances and microstructures of a high-power LED based on rapid thermal cycling 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Proformance Thermal Fatigue  Reliability   A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Property  Thermal Fatigue  Reliability   Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016 作者:  Chen, Jibing*;  Wan, Nang;  Li, Juying;  He, Zhanwen;  Wu, Yiping 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27 lead-free joint  rapid thermal cycle  solder joint  microstructure  IMC  electronic packaging   Acoustic Emission Behavior of Titanium During Tensile Deformation 会议论文 2nd World Conference on Acoustic Emission (WCAE), Shanghai, PEOPLES R CHINA, 2015-01-01 作者:  Shen, Gongtian;  Li, Lifei;  Zhang, Zheng;  Wu, Zhanwen 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 Effect of microstructure and IMC on single SnAgCu solder joint by rapid thermal cycles 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, AUG 11-14, 2015 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Yin, Yanfang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 rapid thermal cycle  solder joint  microstructure  IMC  electronic packaging   Influence of properties and microstructures on thermal fatigue testing of high-power LED 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, AUG 11-14, 2015 作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Yin, Yanfang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 High-power LED  Microstructure  Property  Thermal Fatigue Testing  Reliability   Investigation of acoustic emission (AE) technique application to integrity assessment of crane metal structure 会议论文 作者:  Wu, Zhanwen;  Wang, Shaomei;  Pan, Chunxu;  Shen, Gongtian 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05