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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Dynamic growth of voids under effects of thermal and vapor pressure in electronic packaging (EI收录) 会议论文 13th International Conference on Fracture 2013, ICF 2013, Beijing, China, June 16, 2013 - June 21, 2013 作者:  Yao, Xiaohu[1];  Mei, Yue[1];  Fan, Xuejun[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Elastic moduli  Electronics packaging  Hydrostatic pressure  Polymers  Vapor pressure  Vapors   Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Varia, Bhavesh[1];  Fan, Xuejun[1,2];  Han, Qiang[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/17 Computer crime  Copper  Copper smelting  Materials properties  Packaging  Polymer films  Polymers  Reconstruction (structural)  Reliability  Semiconducting silicon compounds  Silicon wafers  Spheres  Structural design  Technology  Thermomechanical treatment  Three dimensional   Effects of Design, Structure and Material on Thermal-Mechanical Reliability of Large Array Wafer Level Packages (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) 作者:  Varia, Bhavesh[1];  Fan, Xuejun[1,2];  Han, Qiang[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Shock performance study of solder joints in wafer level packages (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Ranouta, Amarinder Singh[1];  Fan, Xuejun[1,2];  Han, Qiang[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Electronics packaging  Finite element method  Fluorine containing polymers  Packaging  Quality assurance  Reliability analysis  Safety factor  Semiconducting intermetallics  Shock testing  Soldering alloys   Shock Performance Study of Solder Joints in Wafer Level Packages (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) 作者:  Ranouta, Amarinder Singh[1];  Fan, Xuejun[1,2];  Han, Qiang[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17