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Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336
作者:  Wei, S;  Zhou, LJ;  Guo, JD
收藏  |  浏览/下载:25/0  |  提交时间:2018/12/25
Performance of a Vertical 4H-SiC Photoconductive Switch With AZO Transparent Conductive Window and Silver Mirror Reflector 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 卷号: 65, 期号: 5, 页码: 2047, 2051
作者:  Cao, Penghui;  Huang, Wei;  Guo, Hui;  Zhang, Yuming
收藏  |  浏览/下载:29/0  |  提交时间:2018/12/28
Design and realization of a new agorithm of calculating the absolute positon angle based on the incremental encoder 会议论文
Nanjing, PEOPLES R CHINA, 2017-10-24
作者:  Liu, Peng;  Yang, Yong-qing;  Li, Zhi-guo;  Han, Jun-feng;  Wei, Yu
收藏  |  浏览/下载:25/0  |  提交时间:2018/07/05


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