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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2016     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 L-Arginine Enhances Resistance against Oxidative Stress and Heat Stress in Caenorhabditis elegans 期刊论文 INTERNATIONAL JOURNAL OF ENVIRONMENTAL RESEARCH AND PUBLIC HEALTH, 2016, 卷号: 13, 期号: 10 作者:  Zhu, Jinming;  Xu, Li;  Guo, Yi;  Ma, Heran;  Ma, Yudan 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05 C. elegans  L-Arg  antiaging  antioxidant  free radical   A Novel Peptide from Soybean Protein Isolate Significantly Enhances Resistance of the Organism under Oxidative Stress 期刊论文 PLOS ONE, 2016, 卷号: 11, 期号: 7 作者:  Guo, Yi;  Ma, Heran;  Liu, Rui;  Zhao, Ziyuan;  Zhang, Zhixian 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05 On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 页码: 7699-7706 作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Guo, Bingfeng;  Meng, Zhixian 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Ma, Haoran;  Kunwar, Anil;  Meng, Zhixian;  Guo, Bingfeng;  Zhao, Ning 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/09 bubbles  cooling rate  gas/solid interface  intermetallic compounds  growth orientation  diffusion  SEM   The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservation Stage 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Jiang, Chengrong;  Guo, Bingfeng;  Ma, Haoran;  Kunwar, Anil;  Meng, Zhixian 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/09 Soldering  Microstructure  Heating Preservation  IMC  Ripening Theory   Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Kunwar, Anil;  Givernaud, Julien;  Ma, Haoran;  Meng, Zhixian;  Shang, Shengyan 收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09 Phase change  Finite element method  Apparent heat capacity  Enthalpy method  Solder