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Performance evaluation of silicon-chip-based mid-infrared Kerr optical frequency combs with ridge cross section 期刊论文
Optik, 2022, 卷号: 266
作者:  Wen, Jin;  Qin, Weijun;  Sun, Wei;  He, Chenyao;  Xiong, Keyu
收藏  |  浏览/下载：22/0  |  提交时间：2022/08/18
High-power operation and lateral divergence angle reduction of broad-area laser diodes at 976 nm 期刊论文
Optics and Laser Technology, 2021, 卷号: 141
作者:  Liu, Yuxian;  Yang, Guowen;  Wang, Zhenfu;  Li, Te;  Tang, Song
收藏  |  浏览/下载：70/0  |  提交时间：2021/05/08
Prediction of end-of-season tuber yield and tuber set in potatoes using in-season uav-based hyperspectral imagery and machine learning 期刊论文
Sensors (Switzerland), 2020, 卷号: 20, 期号: 18, 页码: 1-13
作者:  Sun, Chen;  Feng, Luwei;  Zhang, Zhou;  Ma, Yuchi;  Crosby, Trevor
收藏  |  浏览/下载：25/0  |  提交时间：2020/10/26
Supervised Dimensionality Reduction Methods via Recursive Regression 期刊论文
IEEE TRANSACTIONS ON NEURAL NETWORKS AND LEARNING SYSTEMS, 2020, 卷号: 31, 期号: 9, 页码: 3269-3279
作者:  Liu, Yun;  Zhang, Rui;  Nie, Feiping;  Li, Xuelong;  Ding, Chris
收藏  |  浏览/下载：23/0  |  提交时间：2020/10/23
Planar and ridge waveguides in Yb3+-doped silicate glasses fabricated by proton implantation and precise diamond blade dicing 期刊论文
Optics Communications, 2019, 卷号: 453
作者:  Zhang, Jie;  Guo, Wen-Tao;  Tang, Chen-Yang;  Yan, Sen;  Li, Wei-Nan
收藏  |  浏览/下载：310/0  |  提交时间：2019/08/27
High-Power Single-Longitudinal-Mode DFB Semiconductor Laser Based on Sampled Moiré Grating 期刊论文
IEEE Photonics Technology Letters, 2019, 卷号: 31, 期号: 10, 页码: 751-754
作者:  Liu, Shengping;  Wu, Hao;  Shi, Yuechun;  Qiu, Bocang;  Xiao, Rulei
收藏  |  浏览/下载：69/0  |  提交时间：2019/06/27
Ridge waveguides in magneto-optical glasses formed by combination of proton implantation and precise diamond blade dicing 期刊论文
Optical Engineering, 2019, 卷号: 58, 期号: 5
作者:  Zhu, Qi-Feng;  Long, Xue-Wen;  Wang, Yue;  Shen, Xiao-Liang;  Guo, Hai-Tao
收藏  |  浏览/下载：48/0  |  提交时间：2019/08/11
Self-alignment features for iii-v ridge process and angled facet die 专利
专利号: US20180358778A1, 申请日期: 2018-12-13, 公开日期: 2018-12-13
作者:  BARWICZ, TYMON;  MARTIN, YVES C.;  ORCUTT, JASON S.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/31
Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die 专利
专利号: US10135224, 申请日期: 2018-11-20, 公开日期: 2018-11-20
作者:  TSENG, CHUN-HAO;  KUO, YING-HAO;  YEE, KUO-CHUNG
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/23
Approximate Low-Rank Projection Learning for Feature Extraction 期刊论文
IEEE TRANSACTIONS ON NEURAL NETWORKS AND LEARNING SYSTEMS, 2018, 卷号: 29, 期号: 11, 页码: 5228-5241
作者:  Fang, Xiaozhao;  Han, Na;  Wu, Jigang;  Xu, Yong;  Yang, Jian
收藏  |  浏览/下载：41/0  |  提交时间：2018/11/21

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