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| An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者: Chen, Shujing[1]; Shan, Bo[2]; Yang, Yiqun[3]; Yuan, Guangjie[4]; Huang, Shirong[5]
  收藏 | 浏览/下载：17/0 | 提交时间：2019/04/24
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| Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging 期刊论文
MICROELECTRONICS RELIABILITY, 2016, 卷号: 56, 页码: 129-135
作者: Sun, Shuangxi[1]
收藏 | 浏览/下载：2/0 | 提交时间：2019/04/26
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| Task scheduling and management in single-chip multi-processor system 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者: Hu Yue-li[1]; Wang Yao-ming[2]; Xuan Xiang-guang[3]
收藏 | 浏览/下载：5/0 | 提交时间：2019/05/06 |
| Optimization of hierarchical SOC test time based on genetic algorithm 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者: Li Jiao[1]; Zhang Jinyi[2]; Shi Hui[3]; Luo xiao wei[4]
收藏 | 浏览/下载：5/0 | 提交时间：2019/05/06 |
| The instruction fetch unit design of embedded ultra-micro processor 会议论文
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26
作者: Chen Zhang-Jin[1]; Jin Zhe-Ming[2]; Xu Mei-Hua[3]; Feng, Ran[4]
收藏 | 浏览/下载：2/0 | 提交时间：2019/05/10 |
| IC design of 2Ms/s 10-bit SAR ADC with low power 会议论文
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26
作者: Jun, Cai[1]; Feng, Ran[2]; Mei-Hua, Xu[3]
收藏 | 浏览/下载：1/0 | 提交时间：2019/05/10 |
| Optimizing design and FPGA implementation for CABAC decoder 会议论文
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26
作者: Xu Mei-Hua[1]; Cheng Yu-Lan[2]; Feng, Ran[3]; Chen Zhang-Jin[4]
收藏 | 浏览/下载：1/0 | 提交时间：2019/05/10 |
| Architecture research and IC design for embedded ultra-micro processor 会议论文
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26
作者: Chen Zhang-Jin[1]; Jin Zhe-Ming[2]; Xu Mei-Hua[3]; Feng, Ran[4]
收藏 | 浏览/下载：1/0 | 提交时间：2019/05/10 |
| A novel digital signal interface design used in OLED-on-silicon 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者: Chen, Zhang-Jin[1]; Ran, Feng[2]; Xu, Mei-Hua[3]; Chen, Feng[4]; Lu, Chao[5]
收藏 | 浏览/下载：3/0 | 提交时间：2019/05/10 |
| Analysis and application performance simulation of subband adaptive filtering structures 会议论文
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006-06-27
作者: Chen Guanghua[1]; Ye Jun[2]; Liu Junhai[3]
收藏 | 浏览/下载：1/0 | 提交时间：2019/05/10 |
