CORC

在结果中检索

CORC

浏览/检索结果: 共25条，第1-10条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Isotropic Silicon Etching With XeF2 Gas for Wafer-Level Micromachining Applications 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2012, 卷号: 21, 期号: 6, 页码: 1436-1444
Xu, DH; Xiong, B; Wu, GQ; Wang, YC; Sun, X; Wang, YL
收藏  |  浏览/下载：14/0  |  提交时间：2013/04/23
A novel capacitive accelerometer with a highly symmetrical double-sided beam-mass structure 期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2012, 卷号: 179, 页码: 291-296
Zhou, XF; Che, LF; Xiong, B; Li, XL; Wu, J; Wang, YL
收藏  |  浏览/下载：8/0  |  提交时间：2013/04/23
Design, Fabrication and Characterization of a 5x5 Array of Piezoresistive Stress and Temperature Sensors 期刊论文
MICRO-NANO TECHNOLOGY XIII, 2012, 卷号: 503, 页码: 43-48
Dou, CG; Wu, YH; Yang, H; Li, XX
收藏  |  浏览/下载：13/0  |  提交时间：2013/04/23
Fabrication of integrated microwave passive devices using thick BCB as dielectric at wafer level 期刊论文
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging.ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, 页码: 68-71
Tang, Jiajie; Chen, Xiao; Sun,XW; Luo,L
收藏  |  浏览/下载：15/0  |  提交时间：2012/08/23
Strain Stability and Carrier Mobility Enhancement in Strained Si on Relaxed SiGe-on-Insulator 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 卷号: 157, 期号: 1, 页码: H104-H108
Ma, XB; Liu, WL; Liu, XY; Du, XF; Song, ZT; Lin, CL; Chu, PK
收藏  |  浏览/下载：14/0  |  提交时间：2012/03/24
Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 卷号: 20, 期号: 11, 页码: 115009-115009
Zhou, XF; Che, LF; Xiong, B; Fan, KB; Wang, YL; Wang, ZK
收藏  |  浏览/下载：15/0  |  提交时间：2011/12/17
Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2010, 卷号: 20, 期号: 11 Article Number, 页码: 115009
Zhou, XF; Che, LF; Xiong, B; Fan, KB; Wang, YL; Wang, ZK
收藏  |  浏览/下载：9/0  |  提交时间：2012/05/12
Electrically Pumped Room-Temperature Pulsed InGaAsP-Si Hybrid Lasers Based on Metal Bonding 期刊论文
CHINESE PHYSICS LETTERS, 2009, 卷号: 26, 期号: 6, 页码: 64211-64211
Chen, T; Hong, T; Pan, JQ; Chen, WX; Cheng, YB; Wang, Y; Ma, XB; Liu, WL; Zhao, LJ; Ran, GZ; Wang, W; Qin, GG
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
Fabrication of Total-Dose-Radiation-Hardened (TDRH) SOI wafer with embedded silicon nanoclusters 期刊论文
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2009, 卷号: 267, 期号: 8-9, 页码: 1489-1491
Wu, AM; Wang, X; Wei, X; Chen, J; Chen, M; Zhang, ZX
收藏  |  浏览/下载：17/0  |  提交时间：2012/03/24
MEMS Vertical Probe Cards With Ultra Densely Arrayed Metal Probes for Wafer-Level IC Testing 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2009, 卷号: 18, 期号: 4, 页码: 933-941
Wang, F; Cheng, R; Li, XX
收藏  |  浏览/下载：8/0  |  提交时间：2011/12/17

©版权所有 ©2017 CSpace - Powered by CSpace