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Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
O2 plasma treatment in polymer insulation process for through silicon vias 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Zhuang, Lulu;  Jiang, Kun;  Zhang, Guoping;  Tang, Jiaoning;  Sun, Rong
收藏  |  浏览/下载：17/0  |  提交时间：2015/09/01
A novel temporary adhesive for thin wafer handling 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Shuai, Xingtian;  Sun, Rong;  Zhang, Guoping;  Deng, Libo
收藏  |  浏览/下载：18/0  |  提交时间：2015/09/01
Through-Silicon via Placement with Shuffled Frog Leap Algorithm 会议论文
2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014, 印度尼西亚
作者:  Su, Shaobo;  Li, Huiyun;  Xu, Guoqing
收藏  |  浏览/下载：12/0  |  提交时间：2015/09/01
Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文
2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore
作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Zhongcai Niu;  Wenqi Zhang
收藏  |  浏览/下载：31/0  |  提交时间：2015/09/01
用于薄晶圆加工的临时键合胶 期刊论文
集成技术, 2014
作者:  帅行天;  张国平;  邓立波;  孙蓉;  李世玮
收藏  |  浏览/下载：114/0  |  提交时间：2015/09/01
Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging 会议论文
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China
作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Guoping Zhang;  Jun Fan
收藏  |  浏览/下载：33/0  |  提交时间：2015/09/01
Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者:  Zhao Songfang;  Zhang Guoping;  Sun Rong;  Lee S. W. Ricky
收藏  |  浏览/下载：13/0  |  提交时间：2015/08/27
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via 会议论文
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United states
作者:  Zhao Songfang;  Zhang Guoping;  Peng Chongnan;  Sun Rong;  Lee S. W. Ricky
收藏  |  浏览/下载：42/0  |  提交时间：2015/08/27

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