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Microfluidic cooling for distributed hot-spots 其他
2016-01-01
Pi, Yudan; Wang, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/03
Optimization of Heat Transfer of Microchannels in LTCC Substrate with Via Holes and Liquid Metal 其他
2016-01-01
Liu, Nian; Jin, Yufeng; Miao, Min; Cui, Xiaole
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform 其他
2013-01-01
Miao, Min; Jin, Yufeng; Fang, Runiu; Mu, Fangqing; Guo, Shichao; Zhang, Xiaoqing; Zhang, Yang; Hu, Duwei; Li, Zhensong; Xiang, Wei
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/17
Development of an efficient thermal transfer structure in rapid heat cycle molding 其他
2011-01-01
Fan Zengwei; Ge Xiaohong; Huang Hongwu; Li Hui; 葛晓宏
收藏  |  浏览/下载:5/0  |  提交时间:2015/07/22


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