Microfluidic cooling for distributed hot-spots | |
Pi, Yudan ; Wang, Wei ; Chen, Jing ; Jin, Yufeng | |
2016 | |
关键词 | microfluidic distributed hot-spot thermal spreading THERMAL SPREADING RESISTANCE HEAT SINKS MANAGEMENT |
英文摘要 | 2.5D/3D stacking technique offers a promising solution to extend the Moore Law, meanwhile also leads to a serious heat dissipation challenge. Micro-channels based microfluidic cooling, embedded in the interposer or different layers of 3D IC, targeting at inserting heat sink into each layer, can considerably shorten the heat transfer path and thereby enhance the heat dissipation. It is worth noting that because of the spreading resistance, even with the same micro-channel structure, the effective thermal dissipation capability shows different on varies hot-spot size. In this paper, a micro-fluidic cooling chip with different-sized hot-spots was fabricated to investigate the influence of hot-spot characteristics on the cooling ability of the embedded micro-channel. Relationship between temperature and flow rate was experimentally measured as engineering guide in the thermal design of IC with embedded microfluidic cooling.; EI; CPCI-S(ISTP); w.wang@pku.edu.cn; 903-908; 2016-August |
语种 | 英语 |
出处 | 66th IEEE Electronic Components and Technology Conference (ECTC) |
DOI标识 | 10.1109/ECTC.2016.161 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/449375] |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Pi, Yudan,Wang, Wei,Chen, Jing,et al. Microfluidic cooling for distributed hot-spots. 2016-01-01. |
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