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科研机构
北京航空航天大学 [6]
西安交通大学 [5]
西安理工大学 [3]
清华大学 [2]
中国石油大学(北京) [2]
兰州大学 [1]
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会议论文 [24]
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materials ... [1]
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Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging
会议论文
上海, 2018
作者:
Chang Hao
;
Zhang Baotan
;
Sun Rong
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  |  
浏览/下载:30/0
  |  
提交时间:2019/01/31
Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin
会议论文
1ST INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING (FMSP 2017), 2017-01-01
作者:
Li, He
;
Cui, Yun
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  |  
浏览/下载:8/0
  |  
提交时间:2019/12/30
Electron devices
Electronic equipment
Flexible electronics
Heat conduction
Heat transfer
Skin
Thermoanalysis
Thermoelectric equipment
Bioheat transfer equations
Contact thermal resistance
Direct contact
Flexible electronic devices
Fourier heat conduction
One-dimensional heat
Provide guidances
Temperature increase
Finite element method
Thermally Induced Variation of Bolt Load Considering Thermal Contact Resistance
会议论文
作者:
Zhuo, Ming
;
Yang, Lihua
;
Yu, Lie
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  |  
浏览/下载:4/0
  |  
提交时间:2019/11/26
contact surface
bolt joints
bolt load
heat contact resistance
thermal expansion
Study on Contact Resistance of 10kV Switch Cabinet
会议论文
2016 IEEE PES ASIA-PACIFIC POWER AND ENERGY ENGINEERING CONFERENCE (APPEEC), 2016-01-01
作者:
Li, Yang
;
Duan, Jiandong
;
Liang, Jianfeng
;
Li, Binglin
;
He, Yu
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  |  
浏览/下载:2/0
  |  
提交时间:2019/12/20
Contact resistance
ANSYS
Contact heating
Thermal network method
Research on Test Method of Thermal Contact Resistance between Film/Structure
会议论文
2016 INTERNATIONAL CONFERENCE ON MECHANICAL MANUFACTURING AND ENERGY ENGINEERING (ICMMEE 2016), 2016-01-01
作者:
Wei, Wei
;
Zhang, Weifang
;
Jin, Xiaoshuai
;
Wang, Hongxun
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  |  
浏览/下载:1/0
  |  
提交时间:2019/12/30
Research on Test Method of Thermal Contact Resistance between Film/Structure
会议论文
International Conference on Mechanical Manufacturing and Energy Engineering (ICMMEE), Changsha, PEOPLES R CHINA
作者:
Wei, Wei
;
Zhang, Weifang
;
Jin, Xiaoshuai
;
Wang, Hongxun
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  |  
浏览/下载:1/0
  |  
提交时间:2019/12/30
Unidirectional freezing of phase change materials saturated in open-cell metal foams
会议论文
作者:
Feng, Shangsheng
;
Zhang, Ye
;
Shi, Meng
;
Wen, Ting
;
Lu, Tian Jian
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  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Contact resistance
Metal foam
Local thermal equilibrium
Phase change material
Coupled Simulation of Eddy-Current Thermal Field in Medium Voltage Switchgear
会议论文
作者:
Lu, Hong
;
Wang, Liuhuo
;
Zheng, Wensong
;
Wang, Lijun
;
Lin, Jing
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Medium-voltage switchgear
contact resistance
eddy loss
simulation
temperature rise
Thermal Contact Resistance at the Nb-Cu Interface
会议论文
Proceedings of the 17th International Conference on RF Superconductivity, Canada, 2015
作者:
V.Palmieri
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  |  
浏览/下载:6/0
  |  
提交时间:2016/07/06
The Thermal Contact Resistance Testing Method Study of Thin Film Materials
会议论文
2015 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM), 2015-01-01
作者:
Luo, Renxi
;
Li, Xiaogang
;
Tang, Qingyun
;
Zhang, Weifang
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  |  
浏览/下载:2/0
  |  
提交时间:2020/01/06
thermal contact resistance
thin film materials
heat flux
interface temperature drop
graphite thin film materials
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