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	Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin
	Li, He; Cui, Yun
	2017
会议名称	1ST INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING (FMSP 2017)
会议日期	2017-01-01
关键词	Electron devices Electronic equipment Flexible electronics Heat conduction Heat transfer Skin Thermoanalysis Thermoelectric equipment Bioheat transfer equations Contact thermal resistance Direct contact Flexible electronic devices Fourier heat conduction One-dimensional heat Provide guidances Temperature increase Finite element method
卷号	274
收录类别	EI ; CPCI-S
URL标识	查看原文
WOS记录号	WOS:000426776100023
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5946632
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Li, He,Cui, Yun. Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin[C]. 见:1ST INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING (FMSP 2017). 2017-01-01.

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