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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A heuristic algorithm to balance workloads of high-speed SMT machines in a PCB assembly line 会议论文 作者:  He, Tian;  Li, Debiao;  Yoon, Sang Won 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/21 Surface mount technology  PCB assembly  Workload balance  Heuristics   Design and Application of CAD-CAM Data Interface in Electronic Assembly Production (CPCI-S收录) 会议论文 2013 FOURTH INTERNATIONAL CONFERENCE ON DIGITAL MANUFACTURING AND AUTOMATION (ICDMA) 作者:  Liu Haiming[1];  Hu Yueming[1];  Yuan Peng[1];  Luo Jiaxiang[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 CAD-CAM data interface  data extraction and conversion  PCB file  electronic assembly   Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文 ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17, 2011 - June 19, 2011 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  En, Yunfei[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Finite element method  Lead  Maintenance  Modal analysis  Organic pollutants  Polychlorinated biphenyls  Printed circuit manufacture  Reliability  Safety engineering  Strain  Three dimensional  Three dimensional computer graphics   Investigation for the Response of PCB Assembly with Five POP Packages during Dropping (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Yu Peng[1];  Fan Zerui[1];  Yao Xiaohu[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Effect of Solder Joint Parameter on Vibration Fatigue Reliability of High Density PCB Assembly (CPCI-S收录) 会议论文 2011 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE) 作者:  Qi, Xueli[1];  Zhou, Bin;  En, Yunfei 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 PCB assembly  solder joint parameter  random vibration  fatigue reliability   Effect of Fixation Method on Solder Joint Vibration Fatigue Reliability of High Density PCB Assembly (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Investigation for the response of PCB assembly with five POP packages during dropping (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Yu, Peng[1];  Fan, Zerui[1];  Yao, Xiaohu[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Computer simulation  Computer software  Electronics packaging  Finite element method  Organic pollutants  Packaging  Polychlorinated biphenyls  Printed circuit manufacture   Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Electronics packaging  Finite element method  Modal analysis  Organic pollutants  Packaging  Polychlorinated biphenyls  Printed circuit manufacture  Reliability  Screws  Three dimensional  Three dimensional computer graphics   Optimizing feeder arrangement of a PCB assembly machine for multiple boards (EI收录) 会议论文 IEEM2010 - IEEE International Conference on Industrial Engineering and Engineering Management, Macao, China, December 7, 2010 - December 10, 2010 作者:  Wu, Y.Z.[1];  Ji, P.[1,2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16 Assembly machines  Feeding  Industrial engineering  Mathematical models  Optimization  Printed circuit manufacture   Optimization algorithm for low-volume and high-mix PCB assembly (EI收录) 会议论文 5th International Conference on Natural Computation, ICNC 2009, Tianjian, China, August 14, 2009 - August 16, 2009 作者:  Haiming, Liu[1];  Peng, Yuan[1];  Jiaxiang, Luo[1];  Mei, Zhang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Algorithms  Assembly  Polychlorinated biphenyls  Printed circuit manufacture  Printed circuits