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	Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly (EI收录)
	Qi, Xueli[1,2]; Zhou, Bin[2]; En, Yunfei[2]
会议名称	ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering
会议日期	June 17, 2011 - June 19, 2011
会议地点	Xi'an, China
关键词	Finite element method Lead Maintenance Modal analysis Organic pollutants Polychlorinated biphenyls Printed circuit manufacture Reliability Safety engineering Strain Three dimensional Three dimensional computer graphics
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2059530
专题	华南理工大学
作者单位	1.[1] School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China 2.[2] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
推荐引用方式 GB/T 7714	Qi, Xueli[1,2],Zhou, Bin[2],En, Yunfei[2]. Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly (EI收录)[C]. 见:ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering. Xi'an, China. June 17, 2011 - June 19, 2011.

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