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Microstructure and mechanical properties of the 2D C/SiC/TC4 joints brazed with Cu-Ti + Mo 会议论文
8th High Temperature Ceramic Matrix Composites Conference, HTCMC 2013, September 22, 2013 - September 26, 2013, Xi'an, Shaanxi, China
Yang H.; Fan S.; Wang X.; Cheng L.; Zhang L.
收藏  |  浏览/下载:16/0  |  提交时间:2015/04/27
Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate 会议论文
Xu, Hong Yan; Wu, Hu; Xu, Bing Sheng; Wu, Yan
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/13
Experiments on the mechanical behavior of anodically bonded interlayer of Pyrex Glass/Al/Si 会议论文
Beijing, China, June 16, 2013 - June 21, 2013
作者:  Hu YQ;  Zhao YP(赵亚溥)
收藏  |  浏览/下载:16/0  |  提交时间:2018/11/08
The Activity Coefficient of Tin in the Solid Solution of Iron 会议论文
作者:  Li, Hai-bin;  Huang, Qing-xue;  Wang, Jian-mei;  Gui, Hai-lian;  Ma, Qin
收藏  |  浏览/下载:8/0  |  提交时间:2019/11/15
Nitrogen-rich titanium nitride serving as Pt-Al diffusion barrier for FeRAM application 会议论文
INTEGRATED FERROELECTRICS, 19th International Symposium on Integrated Ferroelectrics, Bordeaux, FRANCE, Web of Science
Xue, Kan-Hao; Ren, Tian-Ling; Xie, Dan; Jia, Ze; Zhang, Ming-Ming; Liu, Li-Tian
收藏  |  浏览/下载:3/0
Joining of silicon carbide ceramic for optical application by reaction bonded technology 会议论文
Proceedings of the SPIE - The International Society for Optical Engineering, 2010
作者:  Aifang Zhang;  Yichao Chen;  Zhiqiang Chen;  Hong Liu;  Jingzhong Fang
收藏  |  浏览/下载:8/0  |  提交时间:2016/11/25
Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure 会议论文
International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27
作者:  Duan, LL;  Yu, DQ;  Han, SQ;  Zhao, J;  Wang, L
收藏  |  浏览/下载:1/0  |  提交时间:2020/01/02
Effect of dipole layer of Alq3 and metal on organic electroluminescence 会议论文
2007年国际有色金属大会, 长沙, 2007
作者:  XU Xue
收藏  |  浏览/下载:6/0  |  提交时间:2020/01/13


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