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A low cost method to synthesize silver nanoparticles for the screen printing conductive inks 会议论文
Harbin, China
作者:  Zhuang Wang;  Tao Zhao;  Xiangwen Liang;  PengLi Zhu;  Rong Sun
收藏  |  浏览/下载：19/0  |  提交时间：2018/02/02
Effect of electroplating parameters on microstructure of copper coating on carbon fibers used for fabrication of aluminum matrix composite 会议论文
21st International Conference on Composite Materials, ICCM 2017, Xi'an, China, 2017-08-20
作者:  Sha, Jianjun;  Lv, Zhaozhao;  Zu, Yufei;  Zhang, Zhaofu;  Wang, Shouhao
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Effect of electroplating parameters on microstructure of copper coating on carbon fibers used for fabrication of aluminum matrix composite 会议论文
21st International Conference on Composite Materials (ICCM21)
作者:  Sha JJ(沙建军)
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/03
Composite Process to Fabricate Low Impedance and Long Electrical Stability Platinum Gray Microelectrodes Using Iridium Oxide 会议论文
NEMS2016, Matsushima Bay and Sendai City
作者:  Youlin Yin;  Kai Xia;  Yan Li;  Tianzhun Wu;  Minghua Tang
收藏  |  浏览/下载：20/0  |  提交时间：2017/01/15
High-resolution Artificial Retina Project in SIAT-CAS 会议论文
Optofluidics2016, Beijing
作者:  Tianzhun Wu
收藏  |  浏览/下载：25/0  |  提交时间：2017/01/15
Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Jinqi Xie;  Zhe Zhong;  Kai Zhang;  Matthew M.F. Yuen;  S.W. Ricky Lee
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Tang, Fangwu;  Huang, Mingliang;  Huang, Feifei
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applications 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Huang, Feifei;  Liu, Yawei;  Huang, Mingliang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
IEEE Electronic Components and Technology Conference（ECTC）, 美国
作者:  Guoping Zhang;  Kun Jiang;  Qiang Liu;  Jinhui Li;  Rong Sun
收藏  |  浏览/下载：15/0  |  提交时间：2016/01/27
Effects of Stirring Speed on Composition and Morphology of Non-cyanide Co-electroplating Au-Sn Thin Films 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Liu, Yawei;  Huang, Mingliang;  Huang, Feifei;  Zhao, Ning
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09

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