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| Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging 会议论文
上海, 2018
作者: Chang Hao; Zhang Baotan; Sun Rong
  收藏 | 浏览/下载：30/0 | 提交时间：2019/01/31 |
| High thermal conductive epoxy resin composites filled with Al2O3@BN core-shell hybrid particles 会议论文
上海, 2018
作者: Huayuan Li; Yuan Gao; Pengli Zhu; Gang Li; Rong Sun
收藏 | 浏览/下载：24/0 | 提交时间：2019/01/31 |
| Influence of the morphology of alumina filler on electrical and thermal properties of epoxy resin composites 会议论文
作者: Ma, Jiawei; Gao, Naikui; Ren, Tengyue; Pan, Zehua; Jin, Haiyun
收藏 | 浏览/下载：5/0 | 提交时间：2019/11/19
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| Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文
Harbin, China
作者:
收藏 | 浏览/下载：18/0 | 提交时间：2018/02/02 |
| Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-Silicon Carbide Fibers Three-Phase Composites 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Xiaoliang Zeng; Kun Guo; Shuhui Yu; Rong Sun; Jian-Bin Xu
收藏 | 浏览/下载：16/0 | 提交时间：2017/01/15 |
| Study on Electric Properties of Epoxy with High Mass Fraction of Alumina Fillers 会议论文
作者: Guo, Zihao; Wang, Haoran; Li, He; Wang, Chuang; Liu, Lilan
收藏 | 浏览/下载：12/0 | 提交时间：2019/11/26
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| Experiment Study on Arc Ablation Resistance Performance of Epoxy with Alumina Fillers 会议论文
作者: Guo, Zihao; Wang, Haoran; Li, He; Wang, Chuang; Lv, Xiaolu
收藏 | 浏览/下载：2/0 | 提交时间：2019/12/02
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