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CORC

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Microstructure and Mechanical Properties of C/C Composite/TC17 Joints with Ag-Cu-Ti Brazing Alloy 会议论文
5TH ANNUAL INTERNATIONAL CONFERENCE ON MATERIAL SCIENCE AND ENGINEERING (ICMSE2017), 2018-01-01
作者:  
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials 会议论文
Harbin, China
作者:  Jia-Hui Kang;  Jia-Li Sheng;  Xian-Zhu Fu;  Rong Sun;  Ching-Ping Wong
收藏  |  浏览/下载：15/0  |  提交时间：2018/02/02
Influence of Biocompatible Ag, Fe, Y Ions on the Behavior Of Mg–1Ca Alloy Treated With MEVVA 会议论文
Yang Liu; Yufeng Zheng; Yong Han
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者:  Yu Zhang;  Pengli Zhu;  Gang Li;  Baotan Zhang;  Rong Sun
收藏  |  浏览/下载：12/0  |  提交时间：2016/01/27
Influence of magnetic field on the microstructure and properties of Cu-Ag-Zr alloy 会议论文
Chinese Materials Congress, CMC 2014, 2014-07-04
作者:  Li H.;  Jia C.X.;  Zhang P.C.;  Jie J.C.;  Li T.J.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Wetting behavior and interfacial characteristic of the Sn-3.5Ag alloy on Ni substrates 会议论文
Zang, Li Kun; Yan, Hong Liang; Yuan, Zhang Fu; Lu, Li Ying
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17
Study on Low Silver Sn-Ag-Cu-P Alloy for Wave Soldering 会议论文
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013-07-15
作者:  Wang, Junjie[1];  Wei, Xicheng[2];  Zhu, Wenqi[3];  Wu, Jian[4];  Wu, Nianzu[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Influence of Ag micro-addition on the glass forming ability, thermal stability and compression performance of Cu-based metallic glasses 会议论文
Wuhan, Hubei, China, June 20, 2013 - June 21, 2013
作者:  Zhang, Ling;  Luo, De Chun;  Chang, Wen Chun;  Xu, Xiu Zhi
收藏  |  浏览/下载：13/0  |  提交时间：2020/11/15
Fatigue strength and crack initiation mechanism of very-high-cycle fatigue for low alloy steels 会议论文
8th Symposium on Bulk Metallic Glasses (BMGs)/TMC Annual Meeting and Exhibition, San Diego, CA, FEB 27-MAR 03, 2011
作者:  Zhao AG(赵爱国);  Qian GA(钱桂安);  Hong YS(洪友士)
收藏  |  浏览/下载：28/0  |  提交时间：2013/02/26
Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates 会议论文
Zhang, Xiaorui; Matsuura, Hiroyuki; Tsukihashi, Fumitaka; Yuan, Zhangfu
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03

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