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Fe0/Zn0 PRB technology for the remediation of PCBs contaminated groundwater (EI收录) 会议论文
Applied Mechanics and Materials, Guangzhou, China, December 29, 2012 - December 30, 2012
作者:  Du, Jun[1];  Liu, Yuanyuan[1];  Zhang, Xueqing[1];  Qiu, Mingying[2];  Zhang, Lanying[1]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/15
Hermetically metal sealing random vibration damage mechanism and fatigue life prediction (EI收录) 会议论文
Applied Mechanics and Materials, Dalian, China, August 24, 2013 - August 25, 2013
作者:  Han, Teng[1,2];  He, Xiao Qi[2];  En, Yun Fei[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/15
Design and application of CAD-CAM data interface in electronic assembly production (EI收录) 会议论文
Proceedings - 2013 4th International Conference on Digital Manufacturing and Automation, ICDMA 2013, Qindao, Shandong, China, June 29, 2013 - June 30, 2013
作者:  Haiming, Liu[1];  Yueming, Hu[1];  Peng, Yuan[1];  Jiaxiang, Luo[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/15
A constructal H shaped power distribution network for EBG structure power plane (EI收录) 会议论文
cccc2012 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2012 - Proceedings, Singapore, Singapore, May 21, 2012 - May 24, 2012
作者:  Huang, Hui-Fen[1];  Liu, Shi-Yun[1];  Zhang, Yan[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/15
A modified tabu search algorithm for component placement process optimization of multi-head surface mounting machine (EI收录) 会议论文
Chinese Control Conference, CCC, Hefei, China, July 25, 2012 - July 27, 2012
作者:  Chen, Tiemei[1,2];  Luo, Jiaxiang[1];  Du, Juan[1];  Hu, Yueming[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/15
Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文
ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17, 2011 - June 19, 2011
作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  En, Yunfei[2]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/15
Study of vibration reliability test and simulation for high density PBGA assembly (EI收录) 会议论文
ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17, 2011 - June 19, 2011
作者:  Zhou, Bin[1];  Qi, Xueli[1,2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/15
Investigation for the response of PCB assembly with five POP packages during dropping (EI收录) 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Yu, Peng[1];  Fan, Zerui[1];  Yao, Xiaohu[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/15
Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011
作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/15
A novel hierarchical radial tree based on constructal theory for PCB power plane (EI收录) 会议论文
2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, Hanzhou, China, December 12, 2011 - December 14, 2011
作者:  Huang, Huifen[1];  Liu, Shiyun[1];  Deng, Liangyong[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/15


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