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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文 MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608 作者:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉) 收藏  |  浏览/下载：35/0  |  提交时间：2018/12/12 nanoindentation  constitutive model  rate factor  dimensionless analysis  solder   Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314 作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ 收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25 Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation   Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation 期刊论文 INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 140, 页码: 60-67 作者:  Long X;  Tang WB;  Feng YH(冯义辉);  Chang C;  Keer LM 收藏  |  浏览/下载：35/0  |  提交时间：2018/07/17 Silver Nanoparticles  Strain Rate Sensitivity  Nanoindentation  Strain Rate Sensitivity  Creep Strain Rate  Stress Exponent   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ 收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 Soldering  Interface  Nanoparticles  Growth kinetics  Diffusion   Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints 期刊论文 MATERIALS RESEARCH BULLETIN, 2018, 卷号: 99, 页码: 239-248 作者:  Guo, Bingfeng;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun;  Wang, Yunpeng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Electronic materials  Intermetallic compounds  Microstructure  Electron microscopy  Diffusion   A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 383-391 作者:  Zhang, Shuye;  Yang, Ming;  Wu, Yang;  Du, Jikun;  Lin, Tiesong 收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02 Anisotropic conductive film  high reliability  Sn-3Ag-0.5Cu solder  thermal compression bonding   Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders 期刊论文 Journal of Electronic Materials, 2018, 卷号: Vol.47 No.1, 页码: 612-619 作者:  L. Y. Xu;  S. T. Zhang;  H. Y. Jing;  L. X. Wang;  J. Wei 收藏  |  浏览/下载：11/0  |  提交时间：2019/11/21 Indentation size effect   hardness   creep stress exponent   hardening effect   solder alloys    Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction 期刊论文 MATERIALS LETTERS, 2018, 卷号: 214, 页码: 142-145 作者:  Jiang, J. J.;  Hu, F. Q.;  Zhang, Q. K.;  Song, Z. L. 收藏  |  浏览/下载：19/0  |  提交时间：2018/12/04 Mechanical-properties  Alloying Substrate  Tensile Properties  Bi Segregation  Joints  Embrittlement  Temperature  Melt