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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2018    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02 Soldering  Interface  Nanoparticles  Growth kinetics  Diffusion   Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Kuang, Jiameng;  Huang, Mingliang 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02 sequential soldering  Sn-Cu-Ni  initial Cu concentration  Ni diffusion  cross-solder interaction   Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 electronic packaging  soldering  intermetallic compound  grain orientation  temperature gradient  anisotropy   Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Intermetalic  Linear solder joint  Temperature  Cross-interaction  Mechanism