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Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) 期刊论文
Journal of the Electrochemical Society, 2017, 卷号: 164, 期号: 4, 页码: D126-D129
作者:  Xiao, Hongbin;  Wang, Fuliang*;  Wang, Yan;  He, Hu;  Zhu, Wenhui
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/03
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives 期刊论文
Microelectronic Engineering, 2017, 卷号: 170, 期号: Volume 170, 页码: 54-58
作者:  Xiao, Hongbin;  He, Hu;  Ren, Xinyu;  Zeng, Peng;  Wang, Fuliang*
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017
Cui, Xiaole; Cui, Xiaoxin; Ni, Yewen; Miao, Min; Jin Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
A Region-Based Through-Silicon via Repair Method for Clustered Faults 期刊论文
IEICE TRANSACTIONS ON ELECTRONICS, 2017, 卷号: E100C No.12, 页码: 1108-1117
作者:  Nie, M;  Yan, AB;  Liang, HG;  Ni, TM;  Huang, ZF
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) (EI收录) 期刊论文
Journal of the Electrochemical Society, 2017, 卷号: 164
作者:  Xiao, Hongbin[1,2];  Wang, Fuliang[1,2];  Wang, Yan[1,2];  He, Hu[1,2];  Zhu, Wenhui[1,2]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24
An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon Vias 期刊论文
2017, 卷号: 17, 页码: 106-112
作者:  Wang, Fengjuan;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias 期刊论文
2017, 卷号: 25, 页码: 1164-1167
作者:  Wang, Fengjuan;  Yu, Ningmei
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/20

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