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信息推送-美国防高等研究项目局实施ElectRx项目以支持BRAIN计划 其他
2014-09-02
作者:  王玮
收藏  |  浏览/下载:50/0  |  提交时间:2014/09/03
On the second derivative of some kinds of Bent functions 其他
2014-01-01
Zhang, Xinyang; Zhou, Meng
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/16
Increased Na+/Ca2+ exchanger activity promotes resistance to excitotoxicity in cortical neurons of the ground squirrel(a hibernator) 其他
2014-01-01
柴真; 赵娟娟; 高珊; 景军展; 朱明月; 周辰; 魏军
收藏  |  浏览/下载:2/0  |  提交时间:2015/10/23
DrugComboRanker: drug combination discovery based on target network analysis 其他
2014-01-01
Huang, Lei; Li, Fuhai; Sheng, Jianting; Xia, Xiaofeng; Ma, Jinwen; Zhan, Ming; Wong, Stephen T. C.
收藏  |  浏览/下载:6/0  |  提交时间:2015/11/13
Identity-Based Encryption on RSA Without Pairings and Key Escrow 其他
2014-01-01
Zhu Yan; Wang Shanbiao; Ma Di; Feng Rongquan
收藏  |  浏览/下载:4/0  |  提交时间:2015/11/16
Cationic polymerization ultraviolet curing method for preparing epoxy resin encapsulation of solar cell: Used for portable photovoltaic devices 其他
2014-01-01
Mengdi, Dong; Biao, Yang; Bo, You; Yandan, Lin; Yaojie, Sun; Zhong, Zhuang
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/13
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载:4/0  |  提交时间:2015/11/17
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载:2/0  |  提交时间:2017/12/03
Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology 其他
2014-01-01
Xu, Yichao; Miao, Min; Fang, Runiu; Sun, Xin; Zhu, Yunhui; Sun, Minggang; Wang, Guanjiang; Jin, Yufeng
收藏  |  浏览/下载:5/0  |  提交时间:2017/12/03
High throughput fabrication of titanium nanopillars by maskless plasma etching 其他
2014-01-01
Li, N.N.; Zhu, N.L.; Zhang, Y.F.; Sun, Y.H.; Chen, J.
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/03


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