QQ客服 官方微博 反馈留言

浏览/检索结果: 共3条，第1-3条 帮助 限定条件 发表日期：2014    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A FEM coupling model for properties prediction during the curing of an epoxy adhesive for a novel assembly of radio telescope panel 会议论文 Montréal, Quebec, Canada, 2014-6-22 Shouwei Hu; Yi Chen 收藏  |  浏览/下载：24/0  |  提交时间：2015/03/12 material modeling  multiphysics FEM  epoxy adhesive  cure shrinkage  viscoelastic effect  residual stresses   A novel temporary adhesive for thin wafer handling 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国 作者:  Shuai, Xingtian;  Sun, Rong;  Zhang, Guoping;  Deng, Libo 收藏  |  浏览/下载：18/0  |  提交时间：2015/09/01 Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Electrically conductive adhesives  nano additives  mechanical properties  reliability of interconnects  printed electronics