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Means for improved implementation of laser diodes and laser diode arrays 专利
专利号: US20120281725A1, 申请日期: 2012-11-08, 公开日期: 2012-11-08
作者:  HUFF, MICHAEL A.;  JACOB, JONAH
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/30
발명의 명칭 레이저 빔 강도의 선형 제어가 가능한 레이저 납땜 장치 및 레이저 용접 장치 专利
专利号: KR101184338B1, 申请日期: 2012-09-13, 公开日期: 2012-09-20
作者:  KIM, SANG JOON
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/23
Method for the production of an optoelectronic component using thin-film technology 专利
专利号: US8247259, 申请日期: 2012-08-21, 公开日期: 2012-08-21
作者:  GROLIER, VINCENT;  PLOSSL, ANDREAS
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/24
Conduction cooled package laser and packaging method for forming the same 专利
专利号: US20120082176A1, 申请日期: 2012-04-05, 公开日期: 2012-04-05
作者:  OU, SZUTSUN SIMON;  HSIAO, PO-WEN;  HSIEH, CHIA-HUNG;  YANG, HUI-PING;  HSU, YING-FENG
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/30
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
high-power diode laser technology and applications x, san francisco, ca, united states, january 22, 2012 - january 24, 2012
作者:  Nie, Zhiqiang;  Zhang, Pu
收藏  |  浏览/下载:9/0  |  提交时间:2013/03/08


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