QQ客服 官方微博 反馈留言

	Means for improved implementation of laser diodes and laser diode arrays
	HUFF, MICHAEL A.; JACOB, JONAH
	2012-11-08
著作权人	CORPORATION FOR NATIONAL RESEARCH INITIATIVES
专利号	US20120281725A1
国家	美国
文献子类	发明申请
其他题名	Means for improved implementation of laser diodes and laser diode arrays
英文摘要	A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.
公开日期	2012-11-08
申请日期	2012-07-16
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54353]
专题	半导体激光器专利数据库
作者单位	CORPORATION FOR NATIONAL RESEARCH INITIATIVES
推荐引用方式 GB/T 7714	HUFF, MICHAEL A.,JACOB, JONAH. Means for improved implementation of laser diodes and laser diode arrays. US20120281725A1. 2012-11-08.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。