| Drop analysis of 3D SiP with Through Silicon Via | |
| Yao, Ruixia; Li, Tenghui; Huang, Pengfei; Su, Fei | |
| 2017 | |
| 会议名称 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2017-01-01 |
| 关键词 | 3D System in Package with Through Silicon Via Finite Element Analysis drop/impact reliability |
| 页码 | 1157-1162 |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000431392000253 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5943934 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Yao, Ruixia,Li, Tenghui,Huang, Pengfei,et al. Drop analysis of 3D SiP with Through Silicon Via[C]. 见:2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2017-01-01. |
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