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	Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate
	Peng, Changfei[1]; Shen, Jun[1]; Xie, Weidong[1]; Chen, Jie[1]; Wu, Cuiping[1]; Wang, Xiaochuan[1]
	2011
卷号	22页码:797-806
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2970683
专题	重庆大学
推荐引用方式 GB/T 7714	Peng, Changfei[1],Shen, Jun[1],Xie, Weidong[1],et al. Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate[J],2011,22:797-806.
APA	Peng, Changfei[1],Shen, Jun[1],Xie, Weidong[1],Chen, Jie[1],Wu, Cuiping[1],&Wang, Xiaochuan[1].(2011).Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate.,22,797-806.
MLA	Peng, Changfei[1],et al."Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate".22(2011):797-806.

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