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	Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints
	Wu, Cuiping[1]; Shen, Jun[1]; Peng, Changfei[1]
	2012
卷号	23页码:14-21
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2967471
专题	重庆大学
推荐引用方式 GB/T 7714	Wu, Cuiping[1],Shen, Jun[1],Peng, Changfei[1]. Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints[J],2012,23:14-21.
APA	Wu, Cuiping[1],Shen, Jun[1],&Peng, Changfei[1].(2012).Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints.,23,14-21.
MLA	Wu, Cuiping[1],et al."Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints".23(2012):14-21.

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