Study of Temperature-Dependent Mechanisms and Characteristics of 4H-SiC Junction Barrier Schottky Rectifiers
Xu SD(徐少东); Dong SX(董升旭); Bai Y(白云); Liu XY(刘新宇); Tang YD(汤益丹)
刊名Materials Science Forum
2018-06-05
文献子类期刊论文
内容类型期刊论文
源URL[http://159.226.55.107/handle/172511/18992]  
专题微电子研究所_高频高压器件与集成研发中心
作者单位中国科学院微电子研究所
推荐引用方式
GB/T 7714
Xu SD,Dong SX,Bai Y,et al. Study of Temperature-Dependent Mechanisms and Characteristics of 4H-SiC Junction Barrier Schottky Rectifiers[J]. Materials Science Forum,2018.
APA Xu SD,Dong SX,Bai Y,Liu XY,&Tang YD.(2018).Study of Temperature-Dependent Mechanisms and Characteristics of 4H-SiC Junction Barrier Schottky Rectifiers.Materials Science Forum.
MLA Xu SD,et al."Study of Temperature-Dependent Mechanisms and Characteristics of 4H-SiC Junction Barrier Schottky Rectifiers".Materials Science Forum (2018).
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