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Stable Red Light-Emitting Devices Based onCd:CsMnBr3With High Photoluminescence Quantum Yield via Cd Incorporation 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 页码: 6
作者:  Ma, Yibo;  Zhang, Xiaodong;  Qiu, Haiyu;  Guo, Jing;  Tian, Chuan
收藏  |  浏览/下载：5/0  |  提交时间：2023/12/12
Effect of UV wavelength on humic acid degradation and disinfection by-product formation during the UV/chlorine process 期刊论文
Water research, 2019, 卷号: 154, 页码: 199-209
作者:  Gao Ze-Chen[1];  Lin Yi-Li[2];  Xu Bin[3];  Xia Ying[4];  Hu Chen-Yan[5]
收藏  |  浏览/下载：45/0  |  提交时间：2019/04/22
Light-emitting diode 585 nm photomodulation inhibiting melanin synthesis and inducing autophagy in human melanocytes 期刊论文
JOURNAL OF DERMATOLOGICAL SCIENCE, 2018, 卷号: 89, 期号: 1
作者:  Chen, Li;  Xu, Zhongyi;  Jiang, Min;  Zhang, Chengfeng;  Wang, Xuan
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Design a Modified Bi-directional Converter for Solar LED Lighting System 会议论文
作者:  Wang, Yiwang;  Chen, Xiaogao;  Tang, Houjun;  Yang, Yong;  Wen, Huiqing
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/19
Development of an Al2O3 filled composite for the bracket of ultraviolet light-emitting diodes (UV-LEDs) 期刊论文
OPTICAL MATERIALS, 2018, 卷号: 83, 页码: 356-362
作者:  Zhang, Lei;  Zheng, Yiting;  Mao, Jiale;  Wang, Shuang;  Fu, Ruotian
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26
High-Efficiency Resonant LED Backlight Driver with Passive Current Balancing and Dimming 期刊论文
IEEE Transactions on Industrial Electronics, 2018, 卷号: Vol.65 No.7, 页码: 5474-5486
作者:  Liu, X.;  Zhou, Q.;  Xu, J.;  Lei, Y.;  Wang, P.
收藏  |  浏览/下载：3/0  |  提交时间：2019/02/25
A New Thermal Interface Material: Graphene-epoxy Composite used for LED Heat Dissipation 期刊论文
CHIANG MAI JOURNAL OF SCIENCE, 2018, 卷号: Vol.45 No.6, 页码: 2459-2470
作者:  Zhang, Yin;  Long, Enshen;  Zhang, Mingshan
收藏  |  浏览/下载：9/0  |  提交时间：2019/02/25
Ionic Wind Development in Corona Discharge for LED Cooling 期刊论文
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2018, 卷号: 46, 期号: 5, 页码: 1821-1830
作者:  Wang, Jing[1];  Cai, Yi-Xi[2];  Li, Xiao-Hua[3];  Shi, Yun-Fei[4];  Bao, Ya-Chao[5]
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/24
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30

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