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CORC

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Buckling analysis of stiffened composite panels with variable stiffness 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Wu, W.;  Bai, R. X.;  Lei, Z. K.;  Geng, C. H.;  Zhang, X. Z.
收藏  |  浏览/下载：118/0  |  提交时间：2019/12/02
Oxidation Kinetics Researches under the Condition of Compressive Loading 会议论文
2018 2ND INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES IN MANUFACTURING AND MATERIALS ENGINEERING (ATMME 2018), 2018-01-01
作者:  Zhou, C. H.;  Pan, R. Y.;  Ma, H. T.;  Zhang, H.;  Guan, X. G.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Li, S.;  Yao, M.J.;  Wang, Y.P.;  Chen, J.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kunwar, Anil;  Tonks, Michael R.;  Shang, Shengyan;  Song, Xueguan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Wang, Y.P.;  Chen, J.;  Ma, H.T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The Visual Object Tracking VOT2016 Challenge Results 会议论文
14th European Conference on Computer Vision (ECCV), Amsterdam, NETHERLANDS
作者:  Kristan, Matej;  Leonardis, Ales;  Matas, Jiri;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：24/0  |  提交时间：2019/12/09
Automatic design method and application in complex ship block lifting 会议论文
International Conference on Computer Applications in Shipbuilding 2015, ICCAS 2015
作者:  Li R.;  Wang J.;  Liu Y.J.;  Zhang F.;  Ma C.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
Biosorption of nickel ions by modified chitosan from aqueous solutions 会议论文
Applied Mechanics and Materials
作者:  Ma W(马伟);  Wang R(王刃)
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/11

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