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Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文
materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123
Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian)
收藏  |  浏览/下载:31/0  |  提交时间:2010/04/11
A model of dislocations at the interface of the bonded wafers 会议论文
conference on optical interconnects for telecommunication and data communications, beijing, peoples r china, nov 08-10, 2000
作者:  Han WH;  Wang LC
收藏  |  浏览/下载:16/0  |  提交时间:2010/10/29


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