CORC

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CORC

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The microstructure of Ni-based surface infiltrated layer on cast steel substrate 会议论文
Shenzhen, China, November 18, 2011 - November 20, 2011
作者:  Yang, Gui-Rong;  Song, Wen-Ming;  Ma, Ying;  Hao, Yuan
收藏  |  浏览/下载：13/0  |  提交时间：2020/11/15
The Microstructure of Ni-based Surface Infiltrated Layer on Cast Steel Substrate 会议论文
作者:  Yang, Gui-rang;  Song, Wen-ming;  Ma, Ying;  Hao, Yuan
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15
The lattice change of Ni-P layer coated on single-walled carbon nanotubes 会议论文
Guilin, China, April 9, 2011 - April 11, 2011
作者:  Li, Wei Xue;  Shi, Gang;  Dai, Jian Feng;  Wang, Qing
收藏  |  浏览/下载：6/0  |  提交时间：2020/11/15
The Lattice Change of Ni-P Layer Coated on Single-Walled Carbon Nanotubes 会议论文
作者:  Li, Weixue;  Shi, Gang;  Dai, Jianfeng;  Wang, Qing
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15
The high temperature property of Ni/WC infiltrated composite layer on cast iron substrate 会议论文
作者:  Yang, Gui-rong;  Song, Wen-ming;  Sun, Xian-ming;  Ma, Ying;  Lu, Jin-jun
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Synthesis of nanocrystalline intermetallic layer by mechanical attrition 会议论文
135th TMS Annual Meeting, 2006, San Antonio, TX, United states, March 12, 2006 - March 16, 2006
作者:  Wu XL(武晓雷);  Hong YS(洪友士);  Tao N;  Meng XK;  Lu J
收藏  |  浏览/下载：12/0  |  提交时间：2017/06/01
The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering 会议论文
Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, 2005-03-15
作者:  Yu, D.Q.;  Wang, J.H.;  Wang, L.
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02
Formation and Structure of Composite Coating of HAD and Micro-Plasma Oxidation on A3 Steel 会议论文
4th International Conference on Surface Engineering,2004
作者:  Xia Y(夏原);  Guan YJ(关永军);  Chen L;  Chen L;  Chen L
收藏  |  浏览/下载：1299/123  |  提交时间：2007/12/18
In Situ Synthesis of Nanocrystalline Intermetallic Compound Layer During Surface Mechanical Attrition Treatment of Zirconium 会议论文
14th Congress of the International-Federation-for-Heat-Treatment-and-Surface-Engineering, OCT 26-28, 2004 Shanghai, PEOPLES R CHINA, Shanghai, PEOPLES R CHINA, OCT 26-28, 2004
作者:  Sun CY(孙彩云);  Xie JJ(谢季佳);  Wu XL(武晓雷);  Hong YS(洪友士);  Liu G
收藏  |  浏览/下载：1008/27  |  提交时间：2007/12/18
Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure 会议论文
International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27
作者:  Duan, LL;  Yu, DQ;  Han, SQ;  Zhao, J;  Wang, L
收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02

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