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SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Huang, Shulei;  Sun, Rong
收藏  |  浏览/下载:3/0  |  提交时间:2020/01/03
CURE KINETICS STUDY OF A NOVEL DIE ATTACH ADHESIVE FOR HIGH POWER LIGHT-EMITTING DIODE 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA
作者:  Zhang, Baotan;  Sun, Rong;  Han, Yankang;  Zhu, Pengli;  Lu, Daoqiang
收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03
Discovering Neighborhood Pattern Queries by Sample Answers in Knowledge Base 会议论文
32nd IEEE International Conference on Data Engineering (ICDE), Helsinki, FINLAND
作者:  Han, Jialong;  Zheng, Kai;  Sun, Aixin;  Shang, Shuo;  Wen, Ji-Rong
收藏  |  浏览/下载:2/0  |  提交时间:2020/01/03
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen
收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03


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