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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 专题：武汉轻工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling 期刊论文 Soldering and Surface Mount Technology, 2015, 卷号: 27, 期号: 2, 页码: 76-83 作者:  Chen, Jibing*;  Yin, Yanfang;  Ye, Jianping;  Wu, Yiping 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/27 Intermetallic compounds  Solder joints  Thermal fatigue  Microstructure  Sn-Ag-Cu   Investigation of microstructure and optical property of high power LED based on rapid thermal cycling 会议论文 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Chen, Jibing*;  Yin, Yanfang;  Ye, Jianping;  An, Bing;  Wu, Yiping 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/27 high-power LED  rapid thermal cycling  induction heating  microstucture  optical property   Study on risk assessment of amusement ride 会议论文 2012 International Conference on Mechanical Engineering, Materials Science and Civil Engineering, ICMEMSCE 2012, Harbin, China, August 18, 2012 - August 20, 2012 作者:  Xiao, Yuan*;  Ye, Jianping;  Chen, Ruomeng;  Qian, Jianjun 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/27 amusement ride  risk assessment  risk matrix   Research on Risk Assessment of Amusement Ride Based on FTA 会议论文 2013 International Conference on Materials,Mechatronics and Automation(ICMMA 2013), Singapore, 2013-04-21 作者:  Yuan Xiao;  Qingsong Jiang;  Ruomeng Chen;  Jianping Ye 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/27