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Achieving long-lived thermally activated delayed fluorescence in the atmospheric aqueous environment by nano-encapsulation 期刊论文
Chemical communications (Cambridge, England), 2019
作者:  Wu Yingnan;  Jiao Long;  Song Fengling;  Chen Miaomiao;  Liu Dapeng
收藏  |  浏览/下载:13/0  |  提交时间:2019/12/02
A spatial phase modulation laser interferometer 期刊论文
OPTICS AND LASERS IN ENGINEERING, 2019, 卷号: 121, 页码: 74-79
作者:  Chen, Ke;  Wang, Zelin;  Guo, Min;  Wang, Xiaona;  Liu, Bowen
收藏  |  浏览/下载:13/0  |  提交时间:2019/12/02
Modeling and real-time prediction for complex welding process based on weld pool 期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 96, 页码: 2495-2508
作者:  Dong, Hang;  Cong, Ming;  Zhang, Yuming;  Liu, Yukang;  Chen, Heping
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/02
Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO 期刊论文
RSC ADVANCES, 2018, 卷号: 8, 页码: 12337-12343
作者:  Guo, Liangchao;  Zhang, Zhenyu;  Kang, Ruiyang;  Chen, Yapeng;  Hou, Xiao
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/02
Real time welding parameter prediction for desired character performance 会议论文
2017 IEEE International Conference on Robotics and Automation, ICRA 2017, Singapore, Singapore, 2017-05-29
作者:  Dong, Hang;  Cong, Ming;  Zhang, Yuming;  Liu, Yukang;  Chen, Heping
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
Synthesis of aryl-substituted indanones and indenes via a highly efficient ligand-free palladium-catalyzed Suzuki coupling process 期刊论文
ARKIVOC, 2016, 页码: 306-327
作者:  Song, Yuming;  Xie, Yamei;  Chen, Minjian;  Qu, Jingping;  Hu, Hongfan
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Predicting Characteristic Performance for Arc Welding Process 会议论文
6th lEEE Annual International Conference on Cyber Technalogy in Automation, Control and Intelligent Systems (IEEE-CYBER), Chengdu, PEOPLES R CHINA, 2016-06-19
作者:  Dong, Hang;  Cong, Ming;  Liu, Yukang;  Zhang, Yuming;  Chen, Heping
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/09
Effect of Electromigration on Interfacial Reaction of Cu/Sn3.0Ag0.5Cu/Ni Solder Joint at High Temperature 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:  Chen, Leida;  Huang, Mingliang;  Zhou, Shaoming;  Ye, Song;  Ye, Yuming
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/18
Electromigration-Induced Failure of Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joint 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:  Zhou, Shaoming;  Huang, Mingliang;  Chen, Leida;  Ye, Song;  Ye, Yuming
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/18


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