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科研机构
大连理工大学 [9]
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期刊论文 [5]
会议论文 [4]
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2019 [2]
2018 [2]
2017 [1]
2016 [2]
2011 [2]
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专题:大连理工大学
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Achieving long-lived thermally activated delayed fluorescence in the atmospheric aqueous environment by nano-encapsulation
期刊论文
Chemical communications (Cambridge, England), 2019
作者:
Wu Yingnan
;
Jiao Long
;
Song Fengling
;
Chen Miaomiao
;
Liu Dapeng
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/02
A spatial phase modulation laser interferometer
期刊论文
OPTICS AND LASERS IN ENGINEERING, 2019, 卷号: 121, 页码: 74-79
作者:
Chen, Ke
;
Wang, Zelin
;
Guo, Min
;
Wang, Xiaona
;
Liu, Bowen
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/12/02
Laser interferometer
Two-beam interference
Spatial phase modulation
Wavelength meter
Thickness measurement
Modeling and real-time prediction for complex welding process based on weld pool
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 96, 页码: 2495-2508
作者:
Dong, Hang
;
Cong, Ming
;
Zhang, Yuming
;
Liu, Yukang
;
Chen, Heping
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/02
Automatic welding
Model and prediction
Gaussian Process Regression (GPR)
Bayesian Optimization Algorithm (BOA)
Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO
期刊论文
RSC ADVANCES, 2018, 卷号: 8, 页码: 12337-12343
作者:
Guo, Liangchao
;
Zhang, Zhenyu
;
Kang, Ruiyang
;
Chen, Yapeng
;
Hou, Xiao
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Real time welding parameter prediction for desired character performance
会议论文
2017 IEEE International Conference on Robotics and Automation, ICRA 2017, Singapore, Singapore, 2017-05-29
作者:
Dong, Hang
;
Cong, Ming
;
Zhang, Yuming
;
Liu, Yukang
;
Chen, Heping
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/09
Synthesis of aryl-substituted indanones and indenes via a highly efficient ligand-free palladium-catalyzed Suzuki coupling process
期刊论文
ARKIVOC, 2016, 页码: 306-327
作者:
Song, Yuming
;
Xie, Yamei
;
Chen, Minjian
;
Qu, Jingping
;
Hu, Hongfan
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/09
Suzuki coupling
ligand-free palladium catalysis
metallocenes
polymerization
Predicting Characteristic Performance for Arc Welding Process
会议论文
6th lEEE Annual International Conference on Cyber Technalogy in Automation, Control and Intelligent Systems (IEEE-CYBER), Chengdu, PEOPLES R CHINA, 2016-06-19
作者:
Dong, Hang
;
Cong, Ming
;
Liu, Yukang
;
Zhang, Yuming
;
Chen, Heping
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/09
Effect of Electromigration on Interfacial Reaction of Cu/Sn3.0Ag0.5Cu/Ni Solder Joint at High Temperature
会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:
Chen, Leida
;
Huang, Mingliang
;
Zhou, Shaoming
;
Ye, Song
;
Ye, Yuming
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/18
Electromigration-Induced Failure of Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joint
会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, PEOPLES R CHINA, 2011-08-08
作者:
Zhou, Shaoming
;
Huang, Mingliang
;
Chen, Leida
;
Ye, Song
;
Ye, Yuming
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/18
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