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Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01
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SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING 会议论文
2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016-01-01
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SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Huang, Shulei;  Sun, Rong
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Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen
收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03
A mesh-independent technique to evaluate stress singularities in adhesive joints 期刊论文
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2015, 卷号: 57, 页码: 105-117
作者:  Zhang, Yu;  Noda, Nao-Aki;  Wu, Peizhen;  Duan, Menglan
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A mesh-independent technique to evaluate stress singularities in adhesive joints (vol 57, pg 105, 2015) 期刊论文
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2015, 卷号: 60, 页码: 130-130
作者:  Zhang, Yu;  Noda, Nao-Aki;  Wu, Peizhen;  Duan, Menglan
收藏  |  浏览/下载:4/0  |  提交时间:2020/01/03


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