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Interfacial evolution behavior and reliability evaluation of cosb(3)/ti/mo-cu thermoelectric joints during accelerated thermal aging 期刊论文
Journal of alloys and compounds, 2009, 卷号: 477, 期号: 1-2, 页码: 425-431
作者:  Zhao, Degang;  Li, Xiaoya;  He, Lin;  Jiang, Wan;  Chen, Lidong
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