CORC

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CORC

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Study on Void Growth in Micro-Size SnAg Solder Bump 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2008, 卷号: 37, 期号: 11, 页码: 1903-1907
Lin, XQ; Luo, L
收藏  |  浏览/下载：17/0  |  提交时间：2012/03/24
Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3, 页码: 307-313
Lin, XQ; Luo, L
收藏  |  浏览/下载：31/0  |  提交时间：2012/03/24
Microstructure and hydrogen storage characteristics of TiMn2-xVx alloys 期刊论文
INTERMETALLICS, 2007, 卷号: 15, 期号: 4, 页码: 593-598
Huang, T; Wu, Z; Sun, GX; Xu, NX
收藏  |  浏览/下载：11/0  |  提交时间：2011/12/17
Effect of stoichiometry on hydrogen storage performance of Ti-Cr-VFe based alloys 期刊论文
INTERMETALLICS, 2005, 卷号: 13, 期号: 10, 页码: 1075-1078
Huang, TZ; Wu, Z; Xia, BJ; Xu, NX
收藏  |  浏览/下载：7/0  |  提交时间：2011/11/08
On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints 期刊论文
PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, 页码: 66-69
Chang, JL; Xia, YH; Xie, XM
收藏  |  浏览/下载：18/0  |  提交时间：2012/03/24
Hydrogen absorption-desorption behavoir of zirconium-substituting Ti-Mn based hydrogen storage alloys 期刊论文
INTERMETALLICS, 2004, 卷号: 12, 期号: 1, 页码: 91-96
Huang, TZ; Wu, Z; Yu, ZB; Chen, JZ; Xia, BJ; Huang, TS; Xu, NX
收藏  |  浏览/下载：7/0  |  提交时间：2011/12/17
CRYSTAL-STRUCTURE, PHASE-STABILITY, AND ELECTRONIC-STRUCTURE OF TI-AL INTERMETALLICS - TI3AL 期刊论文
PHYSICAL REVIEW B, 1991, 卷号: 43, 期号: 3, 页码: 1940-1947
HONG, T; WATSONYANG, TJ; GUO, XQ; FREEMAN, AJ; OGUCHI, T; XU, JH
收藏  |  浏览/下载：14/0  |  提交时间：2012/03/25
CRYSTAL-STRUCTURE, PHASE-STABILITY, AND ELECTRONIC-STRUCTURE OF TI-AL INTERMETALLICS - TIAL3 期刊论文
PHYSICAL REVIEW B, 1990, 卷号: 41, 期号: 18, 页码: 12462-12467
HONG, T; WATSONYANG, TJ; FREEMAN, AJ; OGUCHI, T; XU, JH
收藏  |  浏览/下载：29/0  |  提交时间：2012/03/25

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