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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Preparation method for flip chip full intermetallic compound interconnection welding point, involves providing upper part of second welding plate with welding layer, and providing inter-metallic compound between first plate and second plate. 专利 申请日期: 2015-01-01, 公开日期: 2015-06-17 作者:  HUANG M LIU Y MA H ZHAO N ZHONG Y H 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Preparation of intermetallic compound thin film involves providing first metal substrate, subjecting first metal substrate to plating, sputtering, vapor deposition, or brazing with filler metal layer, and providing second metal substrate. 专利 申请日期: 2015-01-01, 公开日期: 2015-05-27 作者:  HUANG M MA H YANG F ZHANG Z ZHAO J 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09 The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering 会议论文 Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, 2005-03-15 作者:  Yu, D.Q.;  Wang, J.H.;  Wang, L. 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02 Residual stress and wear characteristics of Ni3Al coating layer 期刊论文 7th International Conference onResidual Strsses (ICRS-7), 2005, 卷号: 490-491, 页码: 619-624 作者:  Murotani, T;  Wang, Z;  Ikenaga, A;  Hirose, Y 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02 reactive sintering  hot press  Ni3Al intermetallic compound  spheroidal graphite cast iron  austenitic stainless steel  wear test  residual stress   The effect of temperature on microstructureu and mechanical behavior of the vacuum brazed joint of Ti-46.5Al-5Nb alloy and 42CrMo steel 期刊论文 5th Pacific Rim International Conference on Advanced Materials and Processing, 2005, 卷号: 475-479, 页码: 829-832 作者:  Liu, W;  Gao, Q;  Cong, W;  Guo, JT 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/02 vacuum brazing  compound layer  TiAl  intermetallic   Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure 会议论文 International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, PEOPLES R CHINA, 2004-04-27 作者:  Duan, LL;  Yu, DQ;  Han, SQ;  Zhao, J;  Wang, L 收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02 lead-free solder  Sn-3.5Ag  microstructure  interface reaction  intermetallic compound  electroplated Ni plating   The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering 会议论文 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (2005 AGEC), Shanghai, PEOPLES R CHINA 作者:  Yu, DQ;  Wang, JH;  Wang, L 收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02 lead free solder  Sn-Ag-Cu  intermetallic compounds  growth  melting point   Microstructure and forming mechanism of diffusion brazing interface of TiAl alloy and 42CrMo 期刊论文 Hangkong Cailiao Xuebao/Journal of Aeronautical Materials, 2003, 卷号: 23, 页码: 51-54 作者:  Gao Q.;  Guo J.-T.;  Liu W.;  Zhang J.-S. 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/02 Aluminum alloys  Forming  Interfaces (materials)  Mechanisms  Microstructure  Titanium alloys, Grain boundary  Intermetallic compound layer  Isothermal solidification  Titanium aluminum alloy, Brazing   The stability of a protective Al2O3 layer on a niobium ion-implanted gamma-TiAl intermetallic compound 期刊论文 JOURNAL OF MATERIALS SCIENCE LETTERS, 2000, 卷号: 19, 页码: 1839-1841 作者:  Lei, MK;  Zhu, XP;  Tang, ZL;  Wang, FH 收藏  |  浏览/下载：1/0  |  提交时间：2020/01/02