CORC

浏览/检索结果: 共1条,第1-1条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
Exploration of a new wafer-level hermetic sealing method by Cu/Sn isothermal solidification technique for MEMS/NEMS devices 期刊论文
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, 2005, 卷号: 5650, 页码: 332-336
Du, MH; Xu, W; Luo, L
收藏  |  浏览/下载:14/0  |  提交时间:2012/03/24


©版权所有 ©2017 CSpace - Powered by CSpace