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科研机构
金属研究所 [16]
力学研究所 [1]
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期刊论文 [17]
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2018 [10]
2017 [5]
2016 [1]
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Materials... [17]
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学科主题:Materials Science, Multidisciplinary
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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
A multi-axial low-cycle fatigue life prediction model considering effects of additional hardening
期刊论文
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, 2018, 卷号: 41, 期号: 7, 页码: 1488-1503
作者:
Zhao, BF
;
Xie, LY
;
Bai, X
;
Ren, JG
;
Li, HY
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2018/12/25
additional hardening
critical plane approach
fatigue life prediction
multi-axial fatigue
non-proportional loading
Materials, processing and reliability of low temperature bonding in 3D chip stacking
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:
Zhang, L
;
Liu, ZQ
;
Chen, SW
;
Wang, YD
;
Long, WM
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2018/12/25
3D IC
Low temperature bonding
Bonding method
Reliability
Simulation and experimental research of the free bending process of a spatial tube
期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2018, 卷号: 255, 页码: 137-149
作者:
Guo, XZ
;
Ma, YN
;
Chen, WL
;
Xiong, H
;
Xu, Y
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2018/06/05
Forming Process
Springback Prediction
Model
Diameters
Profile
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:
Shi, QY
;
Liu, ZQ
;
Wu, D
;
Zhang, H
;
Ni, DR
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  |  
浏览/下载:30/0
  |  
提交时间:2018/06/05
Al/diamond Composites
Thermal-conductivity
Coated Diamond
Heat Sinks
Densification
Microstructure
Mechanisms
Strength
Surface
Growth
Effects of intragranular defects on helium accumulation damage in nanocrystalline nitrides
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 401-406
作者:
Lao, YX
;
Niu, WX
;
Shi, YL
;
Du, H
;
Zhang, HB
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2018/06/05
Microstructure Evolution
Radiation Tolerance
Bubble Formation
He Irradiation
Degrees-c
Interfaces
Migration
Ceramics
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:
Zhu, QS
;
Gao, F
;
Ma, HC
;
Liu, ZQ
;
Guo, JD
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/06/05
Stress-relaxation
Void Formation
Electromigration
Reliability
Sn
Interconnections
Thermomigration
Metallization
Mechanisms
Diffusion
A novel evaluation strategy for fatigue reliability of flexible nanoscale films
期刊论文
MATERIALS RESEARCH EXPRESS, 2018, 卷号: 5, 期号: 3, 页码: -
作者:
Zheng, SX
;
Luo, XM
;
Wang, D
;
Zhang, GP
;
Zhang, GP (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci SYNL, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
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  |  
浏览/下载:33/0
  |  
提交时间:2018/06/05
Cu Thin-films
Damage Formation
Length Scale
Gold-films
Behavior
Stretchability
Deformation
Specimens
Thickness
Size
The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles
期刊论文
MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99
作者:
Yuan, J
;
Li, CF
;
Yang, B
;
Liu, ZQ
;
Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.
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  |  
浏览/下载:15/0
  |  
提交时间:2018/06/05
High Saturation Magnetization
Interfacial Reliability
Alloys
Temperature
Fabrication
Relaxation
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